Kingston Technology KF316C10BBK2/8 memory module 8 GB 2 x 4 GB DDR3 240-pin DIMM

• JEDEC standard 1.5V Power Supply
• VDDQ = 1.5V
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• Height 1.338” (34mm) w/heatsink

FURY KF316C10BBK2/8 is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Total kit capacity is 8GB. Each module has been tested to run at DDR3-1600 at a low latency timing of 10-10-10 at 1.5V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. Each 240-pin DIMM uses gold contact fingers.

Features
Internal memory	8 GB
Memory layout (modules x size)	2 x 4 GB
Internal memory type	DDR3
Component for	PC/Server
Memory form factor	240-pin DIMM
ECC	No
CAS latency	10
Memory channels	Dual-channel
Memory voltage	1.5 V
Module configuration	512M x 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	37.5 ns
Country of origin	Taiwan
Cooling type	Heatsink
Backlight	No
Windows operating systems supported	Yes
Linux operating systems supported	Yes
JEDEC standard	Yes

Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C

Weight & dimensions
Width	133.3 mm
Depth	7.1 mm
Height	34 mm

Logistics data
Harmonized System (HS) code	84733020

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